High Precision 3D Laser Profilers for Physical AI: SinceVision at Manufacturing World Osaka 2026

At Manufacturing World Osaka 2026, SinceVision is bringing our advanced 3D laser profilers to the forefront of the newly launched Manufacturing x Physical AI Expo. We provide the high precision hardware required for AI driven manufacturing, capturing the sub micron data that AI systems need to function. Visitors to Booth 21, 26 will see our core 3D laser profiler technology running live application tests, alongside our latest spectral confocal displacement sensors and laser displacement sensors.

• Exhibition: Manufacturing World Osaka 2026 

• Dates: October 7 to 9, 2026

• Venue: INTEX Osaka, Japan

• Location: Hall 3, Booth 21-26

Get Your Free Tickets Here

Exclusive Preview: SGI N030W Laser Displacement Sensor

Ahead of its official launch in October 2026, we are offering an exclusive first look at the SGI N030W laser displacement sensor.

This model features a wide light spot, micron level precision, and a high speed integrated sensor. These specifications are engineered to meet the high precision detection requirements for small sized, thickness measurement workpieces. It is highly suited for production processes in the lithium battery and semiconductor industries, enabling accurate wafer positioning through single point height detection.

Visitors also can experience the live demo of SGI-N030W on

Wafer Positioning and Detection: High-precision single-point height detection to enable accurate wafer positioning

October 2026 Product Launches on Display

While our booth focuses heavily on live applications, we will also feature static displays of two major upcoming releases launching in October 2026:

• SH8 Series High Speed Camera: Designed for capturing microsecond events and troubleshooting high speed production lines.

• B0555 PRO sCMOS Camera: Advanced scientific imaging for demanding research and industrial applications.

Image: SinceVision SH8 Series high-speed camera showcased at BSSM conference in the UK

Live Technical Demonstrations

Our engineering team will run live application demonstrations covering the semiconductor, lithium battery, automotive, and consumer electronics industries.

Semiconductor 

• Dual Head 3D Inspection of BGA Solder Joints: Dual head 3D stitching inspection enables high precision, full coverage BGA measurement with fewer blind spots using two SR9520 3D Laser Profilers.

• Wafer Flatness and Defect Inspection: Precisely detect micron level scratches and height related defects to boost wafer yield. Achieve micron level flatness control and chip scale precision using the SR9520 3D Laser Profiler.

Consumer Electronics

• Transparent Glass Thickness Detection: Rapid thickness measurement of transparent materials with accurate identification of near and far surfaces using the SCI04025 Spectral Confocal Displacement Sensor.

Lithium Battery

• Top Cover Weld Seam Defect Inspection: Accurate detection of blowholes and pits for complete interception of welding defects using the SR8060H 3D Laser Profiler.

Automotive Powertrain

• Automotive Gear Edge Chipping Defect Detection: Acquires 6400 high density points for accurate reproduction of holes and edge chipping using the SR9060 3D Laser Profiler.

AI Hardware Manufacturing for AI Servers

As the demand for AI hardware scales rapidly, manufacturers require absolute precision in component assembly and thermal management. Our high precision optical sensors and 3D laser profilers are actively deployed in AI server production lines for the following applications:

• Enhancing PCBA Quality: Detailed 3D topography inspection for printed circuit board assemblies.

• High Precision Flatness Inspection for AI Server Cooling Plates: Micron level surface verification to prevent thermal bottlenecks.

• AI Server Fan Axial Runout Inspection Solutions: High speed dynamic measurement to guarantee stable cooling performance.

Visit SinceVision at INTEX Osaka

With 1,100 exhibitors and 31,000 visitors expected, Manufacturing World Osaka is western Japan's largest manufacturing trade show. Our team will be available to discuss how our 3D laser profilers and optical sensing hardware integrate with your production lines.

Join us at Hall 3, Booth 21-26 to see how SinceVision technology solves complex inspection challenges.

Book a meeting/demo here