Accelerating Smart Manufacturing in Vietnam: Meet SinceVision at VIMF Bắc Ninh 2026

The Vietnam Industrial and Manufacturing Fair (VIMF) series stands as Southeast Asia's benchmark platform for industrial machinery, precision engineering, and smart factory solutions. Hosted in Vietnam's northern electronics and semiconductor manufacturing corridor, the event brings together leading automation innovators and tier-1 manufacturers.

• Event: Vietnam Industrial and Manufacturing Fair (VIMF) 2026 – Northern Chapter

• Dates: November 4–6, 2026

• Venue: Kinh Bac Cultural Center, Bắc Ninh, Vietnam

  
  

Driving Vietnam's Transition to High-Precision Smart Manufacturing

As global supply chains realign, Vietnam has firmly established itself as a premier global manufacturing powerhouse. Driven by favorable trade policies, robust Foreign Direct Investment (FDI), and an expanding tech infrastructure, the nation is undergoing a decisive shift from labor-intensive assembly to advanced industrial automation, robotics, and digitalized quality control.

In high-growth sectors such as consumer electronics and semiconductor packaging, traditional visual inspection methods can no longer meet the stringent tolerances demanded by miniaturized components and high-speed throughput.

To help manufacturers eliminate production defects, reduce scrap costs, and accelerate cycle times, SinceVision is bringing its cutting-edge machine vision and optical sensing technologies to the Vietnam Industrial and Manufacturing Fair (VIMF) 2026 – Northern Chapter in Bắc Ninh.

Live Demonstrations at Booth 548-551: High-Precision 3D Sensing Applications

At the SinceVision booth, engineering teams and production managers can observe live, inline quality-inspection systems tackling critical manufacturing bottlenecks across electronic assembly and chip packaging lines.

1. Mobile Phone Camera Module Parallelism Testing

• Inspection Objective: Precisely control and measure the parallelism between the optical lens and the Voice Coil Motor (VCM) to prevent image distortion, optical aberrations, and assembly defects.

• Featured Solution: SRI8060 3D Laser Profiler

• Technical Specifications:

• X-axis Width: 36 mm

• Z-axis Height: 18 mm

• X-axis Data Interval: 12 μm

• Linearity: ±0.02%

• Scanning Speed: 3,200 – 67,000 Hz

2. Mobile Phone Middle Frame Structural Metrology

• Inspection Objective: High-speed dimensional measurement and surface contour profiling of metal/composite middle frames to guarantee seamless final housing assembly.

• Featured Solution: SRI8120 3D Laser Profiler

• Technical Specifications:

• X-axis Width: 36 mm

• Z-axis Height: 18 mm

• X-axis Data Interval: 12 μm

• Linearity: ±0.02%

• Scanning Speed: 3,200 – 67,000 Hz

3. PCBA Post-Reflow Solder & Pin Height Inspection

• Inspection Objective: Dual-sensor inline detection of solder bridging, tombstoning, insufficient solder volume, and component lift directly after the reflow oven.

• Featured Solution: Dual SRI8060 3D Laser Profilers 

• Technical Specifications:

• X-axis Width: 36 mm

• Z-axis Height: 18 mm

• X-axis Data Interval: 12 μm

• Linearity: ±0.02%

• Scanning Speed: 3,200 – 67,000 Hz

4. Micron-Level Semiconductor PIN Coplanarity Detection

• Inspection Objective: Ultrafine co-planarity, true position, and pitch measurement for micro-connectors, lead frames, and semiconductor carrier pins to ensure zero connection failure.

• Featured Solution: SR9040 Ultra-High Precision 3D Laser Profiler

• Technical Specifications:

• Line Width: 17 mm

• Depth of Field: 6.6 mm

• Pixel Pitch: 3 μm

• Linearity: ±0.02%

• Frame Rate: 1,500 – 13,000 Hz

Technical Comparison: Sensor Capabilities for Inline Quality Control

Why Leading Tier-1 Manufacturers Partner with SinceVision

Modern manufacturing requiresspeed and zero-defect quality. SinceVision has established itself as an essential partner for electronics and semiconductor firms across the Asia-Pacific region:

• Engineered for Extreme Speeds: Acquisition frame rates reaching 67,000 Hz permit 100% inline inspection without slowing down cycle times.

• Sub-Micron Reliability: Advanced optical triangulation and robust sensor algorithms filter out reflective noise on metallic pins and polished surfaces.

• Turnkey Deployment: Tailored integration support for regional automated production lines, ensuring smooth communication with standard industrial communication protocols and factory MES platforms.

Visit SinceVision at VIMF Bắc Ninh 2026

Experience real-time 3D laser profilers and precision displacement sensors in action. Technical specialists will be available to review CAD files, evaluate sample workpieces, and advise on integration into automated production cells.

• Venue: Kinh Bac Cultural Center, Bắc Ninh, Vietnam

• Date: November 4–6, 2026

• Booth: 548-551

• Connect: Schedule a 1-on-1 technical consultation or reserve a live demonstration slot during the exhibition.