3D Inspection for Electronics Manufacturing in NEPCON ASIA at Vietnam 2026 | Join SinceVision Booth

Date: August 5 to 7, 2026

Venue: VEC HANOI

Stand: Hall 1 Stand C43

As Vietnam expands its electronics manufacturing capabilities, the demand for reliable industrial upgrading is growing. NEPCON ASIA brings decades of operational expertise to Hanoi to bridge supply and demand for Asian enterprises. SinceVision is proud to participate and introduce our advanced sensor technologies to help local and Southeast Asian manufacturers improve quality, lower costs, and boost production efficiency.

Founded in 2014, SinceVision has over a decade of direct experience developing and manufacturing sensor technology. We have successfully deployed our systems across multiple high demand sectors, including consumer electronics, automotive manufacturing, lithium batteries, photovoltaics, semiconductor fabrication, and fundamental scientific research. Our long history of practical application ensures that our hardware is built to survive and perform in real world industrial environments.

High Speed, High Precision, Inline Inspection

Our technical expertise is reflected in our comprehensive product lineup. We specialize in industrial sensors and imaging systems, including 3D laser profilers, laser displacement sensors, color sensors, through beam edge sensors, spectral confocal sensors, high speed imaging systems, and sCMOS cameras.

At NEPCON ASIA Vietnam, we are highlighting our 3D inspection hardware engineered specifically for inline electronics manufacturing. 

Key performance metrics include:

• Resolution: 6400 Pixels

• Sampling Frequency: 67 kHz

• Installation Space: 50 percent Less

• Durability: IP67 Protection

Precision Application Demonstrations

SinceVision delivers authoritative measurement data. We invite attendees to view live demonstrations of our 3D laser profilers solving complex inspection challenges:

• Mobile Phone Camera Module Testing: Precise measurement achieving 4.672 height and 0.005 flatness.

• Lens Module Measurement: Full scale analysis featuring multi material detection adaptability and high speed scanning up to 13 kHz.

• Lens Cover Flatness Difference: Transparent lens imaging providing micron level precision.

• Display Module Inspection: Stable imaging on transparent glass for accurate flatness inspection, alongside edge sealing glue detection to ensure the coating quality of silver glue and the reliability of conductive connections.

• BGA Package Solder Balls: Stable imaging of bright solder balls utilizing dual cameras to eliminate shading effects.

• PCBA Post Reflow Inspection: Dual camera sensor scanning image splicing eliminates imaging masking to measure pin height and solder accurately. Demonstrations will show precise captures of 0.489 mm solder joint height and 1.796 mm pin height.

• Fine Pin Coplanarity Detection: 3D sensor conducting PCBA post reflow pin height and solder joint inspection. Exact detection measuring 2.840 mm height and 0.007 mm flatness.

Watch Live Demo

We design our high speed and high precision inline inspection systems to deliver exact, repeatable data without adding unnecessary complexity to your production line. We invite engineers, facility managers, and industry leaders to visit Hall 1 Stand C43 at VEC HANOI. Speak directly with the SinceVision technical team and see exactly how our sensors can integrate into your manufacturing processes.

Ready to Upgrade Your Electronics Manufacturing?

Do not miss the opportunity to see our inline inspection technology in action. Visit SinceVision at Hall 1 Stand C43 to consult with our technical experts about your specific production challenges.

• Secure Your Pass: Visit the official NEPCON ASIA Vietnam Registration Page to get your exhibition badge today.

• Explore Our Hardware: Review the full technical specifications of our SinceVision 3D Laser Profilers before the show.

• Book a Live Demo: Contact our team at info@sincevision.com to reserve a dedicated demonstration time at our stand.