Corporate News2024/09/05
Wafer Concentricity and Notch Detection in Chip Packaging Testing | Applications of Through-Edge Beam Sensor Applications
In the chip packaging testing phase, accurate detection of wafer concentricity and notch positioning is critical for improving the accuracy of wafer cutting. Proper alignment of the wafer center and notch position directly influences the yield of chip production, making it essential to implement effective measurement solutions. This article discusses the challenges associated with wafer concentricity and notch detection and presents a reliable solution using SinceVision's high-precision edge measurement sensors.
Application Scenario
During the chip packaging process, wafers must be precisely centered and aligned to ensure successful cutting and placement of chips. The concentricity of the wafer and the position of the notch must be accurately detected to enhance cutting precision and minimize waste. Any misalignment can lead to defective chips, resulting in increased production costs and reduced yield.
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