Silicon Rod Size Detection in Silicon Wafer Manufacturing

Industry Applications Photovoltaic Silicon Rod Size Detection in Silicon Wafer Manufacturing
Silicon Rod Size Detection in Silicon Wafer Manufacturing
Silicon Rod Size Detection in Silicon Wafer Manufacturing

Silicon Rod Size Detection in Silicon Wafer Manufacturing

Industry pain points and demands

   Silicon rods are widely used in the field of solar cell manufacturing due to their excellent performance. After the silicon rods are manufactured, they may have defects such as external cracks, voids, bubbles, internal impurities, etc., so strict quality control tests are required before they can be used in subsequent production.

Common challenges include:

· Defects in Silicon Rods: Issues such as cracks, voids, bubbles, and impurities can compromise product performance and lead to production inefficiencies.

· Dimensional Accuracy: Precise measurement of size, arc length, and verticality is required to meet strict industry standards.

· Comprehensive Quality Control: Traditional methods often lack the precision and efficiency needed for high-volume inspections.

 

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SinceVision Solution: SR7060 3D Laser Profiler

01Multi-Dimensional Inspection: Accurately measures size, arc length, and verticality with item precision of up to 0.02mm.
02Advanced Imaging Technology: Utilizes multiple measuring instruments and image algorithm stitching to generate a complete, detailed image of the silicon rod.
03High Efficiency: Enables rapid and precise defect detection, ensuring rods meet stringent quality requirements for photovoltaic applications.

Camera Selection

Model number
SR7060
Reference distance (CD)80mm
Measuring rangeZ-axis height (FS)9.5 mm
X-axis widthNear side41.5 mm
Reference distance44mm
Remote side46.5 mm
Light sourceLight source wavelength405nm blue light
Laser class2M
Laser output power10mW
Repetition accuracyZ-axis (height)0.3μm
X-axis (width)4 μm
linearityZ-axis (height)±0.05% F.S.
Contour data intervalX-axis (width)15 microns
X-axis contour points3200
Reflection Angle (°)30
Scanning speed (Hz)2500 ~ 10000
Dimension (mm)156×97.5×55
Weight (g)750
Temperature characteristic0.02% F.S./℃
Encoder inputSingle-ended, differential encoder is supported
Input/output1 RS232 interface, 1 100Base-TX/1000Base-T Ethernet interface
Operation Temperature0～50℃
Storage Temperature

-20～70℃

Working Humidity35% to 85% without condensation
ESD ProtectionContact discharge 4kV, air discharge 8kV, in accordance with IEC 61000-4-2 standards
EFT protectionPower port 2kV/5 or 100kHz, signal port 1kV/5 or 100kHz, in accordance with IEC 61000-4-4 standards
Impact50Gs/3ms per axis, in accordance with IEC 68-2-27 Ea standard
Vibration10Gs (10-500Hz), compliant with IEC 68-2-6 Fc standard
degrees of protection provided by enclosureIP67, in accordance with IEC 60529 standard