Wafer Thickness, Line Mark, and TTV Detection in Silicon Wafer Manufacturing

Industry Applications Photovoltaic Wafer Thickness, Line Mark, and TTV Detection in Silicon Wafer Manufacturing
Wafer Thickness, Line Mark, and TTV Detection in Silicon Wafer Manufacturing
Wafer Thickness, Line Mark, and TTV Detection in Silicon Wafer Manufacturing

Wafer Thickness, Line Mark, and TTV Detection in Silicon Wafer Manufacturing

Industry pain points and demands

After the silicon wafer is produced, it needs to be tested by a sorting machine for multiple indicators such as thickness, linear marks, TTV, warpage, etc. to determine whether the silicon wafer meets the set requirements, and then sorted into the corresponding bin box according to the test data, and finally the silicon wafer is sorted into different grades.

Key challenges include:

· Thickness Variation: Even slight deviations in wafer thickness can affect performance and production efficiency.

· Line Mark and TTV Defects: Linear marks and high total thickness variation (TTV) reduce wafer quality and usability.

· High-Speed, High-Accuracy Testing: Traditional methods often fail to meet the speed and precision required for sorting wafers into grades.

 

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SinceVision Solution: SR8020 3D Laser Profiler

01Precise Thickness Measurement: Achieves repeatability within 0.5µm, ensuring accurate wafer thickness evaluation.
02TTV and Line Mark Inspection: Detects TTV and line marks with repeatability within 1.5µm, ensuring comprehensive quality assessment.
03High-Speed Detection: Combines ultra-high-profile point density and rapid scanning for efficient and accurate wafer sorting.

Camera Selection

Model number
SR8020
Reference distance (CD)23mm
Measuring rangeZ-axis height (FS)5.2mm
X-axis widthNear side13mm
Reference distance14.5mm
Remote side16mm
Light sourceLight source wavelength405nm blue light
Laser class2M
Laser output power10mW
Repetition accuracyZ-axis (height)0.15μm
X-axis (width)1.5μm
linearityZ-axis (height)±0.02% of F.S.
Contour data intervalX-axis (width)5μm
X-axis contour points3200
Reflection Angle (°)41.5
Scanning speed (Hz)3200 ~ 67000
Dimension (mm)125.5×82×55
Weight (g)650
Temperature characteristic0.02% F.S./℃
Encoder inputSingle-ended, differential encoder is supported
Input/outputOne 100Base-TX/1000Base-T Ethernet interface
Operation Temperature0～50℃
Storage Temperature

-20～70℃

Working Humidity35% to 85% without condensation
ESD ProtectionContact discharge 4kV, air discharge 8kV, in accordance with IEC 61000-4-2 standards
EFT protectionPower port 2kV/5 or 100kHz, signal port 1kV/5 or 100kHz, in accordance with IEC 61000-4-4 standards
Impact50Gs/3ms per axis, in accordance with IEC 68-2-27 Ea standard
Vibration10Gs (10-500Hz), compliant with IEC 68-2-6 Fc standard
degrees of protection provided by enclosureIP67, in accordance with IEC 60529 standard