With the explosive increase of the power density of electronic components, the traditional air-cooled cooling technology is more and more difficult to meet the requirements of electronic components heat dissipation. The micro-channel heat dissipation technology using cooling liquid heat dissipation is gradually applied in micro-channel heat sinks, and the application of this kind of application in very large scale integrated circuits is studied. In the process of heat dissipation, the flow of bubbles in the microchannel directly affects the efficiency of heat dissipation, so a high-speed camera is needed to capture the flow process of bubbles to improve the heat dissipation process.