In the fast-paced consumer electronics industry, particularly in mobile phone manufacturing, the increasing complexity and integration of components present significant challenges. Flexible Printed Circuits (FPCs) are integral to modern smartphones, but their delicate nature makes them susceptible to surface contamination and foreign object defects during the manufacturing process. These defects can lead to product malfunction and decreased reliability. To ensure high product quality and minimize defects, efficient and accurate detection of foreign objects on FPCs is crucial.