Semiconductor Chip-Picking Process with SinceVision High-Speed Camera
The semiconductor chip-picking process requires precise motion control, as even minimal misalignments or pressure inconsistencies can lead to damaged chips and reduced yield.
SinceVision's high-speed cameras can record every subtle motion at thousands of frames per second with high resolution, enabling detailed observation of the chip-picking head's precise contact with the chip surface, application of appropriate pressure, and smooth lifting of the chip.
Through slow-motion playback, minor interactions during the process, such as contact precision and tool alignment, are revealed. These insights are crucial for understanding and ensuring the delicate control needed for successful operation. The data captured by high-speed cameras allow engineers to identify potential issues, such as poor chip adhesion or robotic arm misalignment, providing valuable information to refine and enhance manufacturing processes effectively.
SinceVision Solution: SH6-504 High-Speed Camera
Camera Selection
performance | |||||||
resolution | Frame rate | Record time (memory) | Record time (hard disk) | ||||
40GB | 80GB | 160GB | 4TB | 12TB | 20TB | ||
2560 x 2016 | 3600FPS | 4.6 (s) | 4.6 (s) | 9.2 (s) | 7 (min) | 21 (min) | 35 (min) |
2560 x 1280 | 5600FPS | 4.6 (s) | 4.6 (s) | 9.2 (s) | 7 (min) | 21 (min) | 35 (min) |
2560 x 1024 | 6600FPS | 4.6 (s) | 4.6 (s) | 9.2 (s) | 7 (min) | 21 (min) | 35 (min) |
2560 x 512 | 11000FPS | 2.9 (s) | 5.8 (s) | 11.6 (s) | 9 (min) | 27 (min) | 45 (min) |
2560×256 | 17000FPS | 4.5 (s) | 9 (s) | 18 (s) | 15 (min) | 45 (min) | 75 (min) |
2560×128 | 23000FPS | 5.5 (s) | 11 (s) | 22 (s) | 18 (min) | 54 (min) | 90 (min) |
2560×32 | 50000FPS | 10.4 (s) | 22.8 (s) | 45.6 (s) | 34 (min) | 102 (min) | 170 (min) |
specification | |||
Model number | TYPE | SH6-504 | |
Maximum resolution | Full Resolution | 2560 x 2016 | |
Full shot speed | Full Frame Rate | 3600fps | |
Maximum shooting speed | Maximum Frame Rate | 50000fp | |
Minimum exposure time | Minimum Exposure Time | 1 mu s | |
Pixel size | Pixel Size | 9 microns | |
Standard memory | Standard RAM | 40 GB, 80 GB, and 160 GB are optional | |
Extended memory | Extended Memor | 4T, 12T, and 20T are optional | |
Dynamic range | Dynamic Range | 60dB | |
Analog Gain | Analog Gain | ×2、×4、×8 | |
Bit Resolution | Bit Resolution | 8bit/10bit/12bit | |
Shutte Mode | Shutte Mode | Global shutter | |
Color | Color | Monochrome (M)/Colorful (C) | |
ROI | ROI | Support | |
Lens Mount | Lens Mount | E interface, can be connected to F interface, C interface, EF interface | |
Data Interface | Data Interface | 10 Gigabit Ethernet, Adaptive Gigabit Ethernet | |
Sensitivity | Sensitivity | ISO10000(M);ISO3000(C) | |
Fan Control | Fan Control | Supports on/off, adaptive speed based on temperature | |
Operating Temperature/Humidity | Operating Temperature/Humidity | Standard -10~50 ℃, below 95% (without condensation), customizable -35~65 ℃ wide temperature version | |
Video Signal Output | Video Signal Output | SDI, Ethernet | |
Recording Mode | Recording Mode | Start, End, Center, Random, Manual | |
Trigger Mode | Trigger Mode | Manual, IO, Image | |
External Signal | External Signal | Input: trigger (TTL/switch) signal, synchronization signal, ready signal, event signal, IRIGB code signal Output: trigger (TTL/switch) signal, synchronization signal, ready signal, exposure signal, recording signal | |
Power Supply | Power Supply | Dual power supply, DC24V | |
Dimensions (excluding lens) | Dimensions (excluding lens) | 217D × 110W × 110H, excluding raised parts | |
Weight | Weight | 3.8kg | |
Power Consumption | Power Consumption | 55W | |
Standard Accessories | Standard Accessories | Power cord × 1. AC adapter × 1. Network cable × 1. Camera control software × 1. User manual × 1. Factory certificate of conformity × one |