Wafer Warpage Inspection with SinceVision 3D Laser Profiler
Industry pain points and demands
In semiconductor manufacturing, wafers—being the base material for chips—are often subjected to stress-induced warpage during various production processes. This warpage directly affects wafer quality and can impede production progress. Wafer warpage inspection is vital to detect such issues while ensuring the smoothness of the wafer surface is maintained.
SinceVision's SR7140 3D Laser Profiler offers a precise, non-contact solution for effective and reliable wafer warpage measurements.
Imaging Effect Picture
SinceVision Solution: SR7140 3D Laser Profiler
01SR7140 Precision: X-axis resolution of 3200 points and Z-axis repeatability of 0.5 μm for ultra-precise measurements.
02Wide and Fast Scanning: Line width of 95 mm with a speed range of 2500–8000 to match high-throughput requirements.
03High Camera Stability: Capable of integrating brightness maps for more reliable calculations.
Camera Selection
| Model number | SR7140 | |||
| Reference distance (CD) | 140mm | |||
| Measuring range | Z-axis height (FS) | 24mm | ||
| X-axis width | Near side | 89mm | ||
| Reference distance | 95mm | |||
| Remote side | 96mm | |||
| Light source | Light source wavelength | 405nm blue light | ||
| Laser class | 2M | |||
| Laser output power | 10mW | |||
| Repetition accuracy | Z-axis (height) | 0.5μm | ||
| X-axis (width) | 8μm | |||
| linearity | Z-axis (height) | ±0.05% F.S. | ||
| Contour data interval | X-axis (width) | 30μm | ||
| X-axis contour points | 3200 | |||
| Reflection Angle (°) | 28 | |||
| Scanning speed (Hz) | 2500 ~ 10000 | |||
| Dimension (mm) | 143×93.2×48.3 | |||
| Weight (g) | 730 | |||
| Temperature characteristic | 0.02% F.S./℃ | |||
| Encoder input | Single-ended, differential coders are supported | |||
| Input/output | 1 RS232 interface, 1 100Base-TX/1000Base-T Ethernet interface | |||
| Operation Temperature | 0～50℃ | |||
| Storage Temperature | -20～70℃ | |||
| Working Humidity | 35% to 85% without condensation | |||
| ESD Protection | Contact discharge 4kV, air discharge 8kV, in accordance with IEC 61000-4-2 standards | |||
| EFT protection | Power port 2kV/5 or 100kHz, signal port 1kV/5 or 100kHz, in accordance with IEC 61000-4-4 standards | |||
| Impact | 50Gs/3ms per axis, in accordance with IEC 68-2-27 Ea standard | |||
| Vibration | 10Gs（10-500Hz）符合 IEC 68-2-6 Fc标准标准 | |||
| degrees of protection provided by enclosure | IP67, in accordance with IEC 60529 standard | |||