Semiconductor Electron Components Sorting with SinceVision High-Speed Camera

Semiconductor Electron Components Sorting with SinceVision High-Speed Camera
Semiconductor Electron Components Sorting with SinceVision High-Speed Camera

Semiconductor Electron Components Sorting with SinceVision High-Speed Camera

Industry pain points and demands

In semiconductor testing, a range of specialized equipment, including sorters, probe stations, testers, optical microscopes, and defect observation devices, facilitates various stages of the process. Among these, sorters are essential for chip design validation and final testing, ensuring product quality and performance.

 

Challenges include:

 Precision and Speed: The rapid movement of tiny components makes observing results with standard equipment impractical.

 Space Limitations: Constrained spaces within testing devices require compact, specialized tools.

 Data Collection: Real-time high-resolution footage is needed for accurate analysis and defect detection.


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SinceVision Solution: SH3-103 High-Speed Camera

01Advanced PCB Design: Equipped with a proprietary 20-layer PCB stack and 10Gbps SerDes technology for superior performance.
02Compact and Efficient: Optimized for heat dissipation while fitting seamlessly into confined spaces.
03High Capacity Storage: Proprietary parallel storage architecture supporting up to 4TB of data, ensuring comprehensive fault recording and analysis.

Camera Selection

performance
resolutionFrame rateRecord time (memory)Record time (hard disk)
16GB32GB64GB1TB2TB4TB
1280 x 10243000FPS4.3 s8.6 s17.2 s3.7 min7.4 min14.8 min
1280 x 8003800FPS4.3 s8.6 s17.2 s3.7 min7.4 min14.8 min
1280 x 5126000FPS4.3 s8.6 s17.2 s3.7 min7.4 min14.8 min
1280 x 25612000FPS4.3 s8.6 s17.2 s3.7 min7.4 min14.8 min
1280×12824000FPS4.3s8.6s17.2s3.7min7.4min14.8min
1280×8200000FPS8.3s16.6s33.2s8.8min17.6min35.2min


specification
Model number
TYPESH3-103
Maximum resolutionFull Resolution1280 x 1024
Full shot speedFull Frame Rate3000fps
Maximum shooting speedMaximum Frame Rate200000fp
Minimum exposure timeMinimum Exposure Time1μs, customized for 100 NS
Pixel sizePixel Size14.6μm
Standard memoryStandard RAM16G, 32G, and 64G are optional
Extended memoryExtended Memor1T, 2T, and 4T are optional
Dynamic rangeDynamic Range60dB
Analog gainAnalog GainX 2, x 4, x 8
Bit depthBit Resolution8bit/10bit/12bit
Shutter typeShutte ModeGlobal shutter
ColorColorMonochrome (M)/Colorful (C)
ROIROISupport
Lens MountLens MountE interface, can be connected to F interface, C interface, EF interface
Data InterfaceData Interface10 Gigabit Ethernet, Adaptive Gigabit Ethernet
SensitivitySensitivityISO56000(M);ISO21000(C)
Fan ControlFan ControlSupports on/off, adaptive speed based on temperature
Operating Temperature/HumidityOperating Temperature/HumidityStandard -10~50 ℃, below 95% (without condensation), customizable -35~65 ℃ wide temperature version
Video Signal OutputVideo Signal OutputEthernet
Recording ModeRecording ModeStart, End, Center, Random, Manual
Trigger ModeTrigger ModeManual, IO, Image
External SignalExternal SignalInput: trigger (TTL/switch) signal, synchronization signal, ready signal, event signal, IRIG
Output: trigger, synchronization signal, ready signal
Power SupplyPower SupplyDC24V
Dimensions (excluding lens)Dimensions (excluding lens)90D × 110W × 110H, excluding raised parts
WeightWeight<1.6kg
Power ConsumptionPower Consumption<30W
Standard AccessoriesStandard AccessoriesPower cord × 1. AC adapter × 1. Network cable × 1. Camera control software × 1. User manual × 1. Factory certificate of conformity × one